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Precision Sub Assembly
Technology
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PC Assembly-
Assembly of Thru Hole, SMT (to 0201) and
BGA (single or 2 sided), and mixed technology. Components can be
supplied on a turn-key basis.
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Cable Harnesses-
Layout, assembly and testing of any
level of Harness Assembly for industrial, medical and military
applications. This includes a full menu of services, including
molding, braiding, sockets and pins (including special pins, sockets
and contacts - proprietary custom designs and unavailable obsolete
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Black Boxes-
We can supply Black Boxes of any
nature; test equipment (including stand alone), test equipment
modification, military systems or subsystems and Legacy Black Boxes
with reverse engineering available. Original Designs can be provided
with full packaging design services. |
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Power Supplies-
Designs and manufacture of custom
Power Supplies, Converters, Inverters, Battery Chargers and similar
devices for aerospace, medical, military, communications and
industrial/commercial applications. High, medium and low voltage
devices (400Hz, AC, DC to DC) Switching Multiple Output, High Powered
Miniaturized, Electron beam, Linear, High Frequency, Plasma and Ultra
Low Ripple. |
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RF & Microwave
Components & Systems-
Design and manufacture of RF &
Microwave Hybrids - Thick and Thin Film (from <100MHz to 20GHz), Low
Noise Amplifiers (LNA's)<1db, Amplifiers - Multiple Output/Complex<10W
Switches (Solid State), Switched Filters, Attenuators & Phase
Shifters, Couplers & Power Dividers, Isolators, Frequency
Synthesizers, Up Converters, Down Converters, Digital Log Video
Amplifiers, Image Rejection mixers, VCO's. |
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Filters-
Design, Testing and Tuning of L.C.
Filters, Toroidal, Ferrites, Crystal Filters (including S.A.W.),
Crystal Resonators (including S.A.W.), Thick & Thin Film Filters,
Chebychev, Butterworth, Elliptical, Bessel, Group Delay, Equalized,
Sin (x), X Compensated, Bias Tees, Hi Q Resonators, Frequency
Doublers, Clock & Data Recovery Subsystems, Diplexers, Quadraplexers,
Equalizers, Frequency Generators, DAR's Filters and Delay Lines. We
can meet SCTE 16 2001 for Hum Modulation, Equipment includes Agilent
E8358A and Anritsu 37369C network analyzers to 20 GHz. Design and
construction techniques include Bell Labs, Western Electric, AT&T, TRW
and M.I.T. Design and Analysis software includes Fil-Syn, Eagleware,
Bell Labs, In-house, Wavecon Filter design (Parfil) and Wavecon
transmission line Design (LineCom). Hermetic packaging available as
well as custom cases. Operative temperature -550C to 1250C.
DC to 6GHz.<1Db Insertion loss, >140Db Stop Band.
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Quality Control-
Assemblies produced by Precision
Sub Assembly Technology are produced under Mil F 18327, Mil I
45208 & Mil Q 9858. Our QC manual is compliant with ISO-9000. TQM, SPC
continuous Improvement program based quality system compliant with Mil
Std-2000. |
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Design Services-
Additional
- Digital including Embedded
Processors
- Programming of processors; all
major languages including Linux.
- RF signal, Switching, Linear, and
Power Designs.
- Power Supplies and Low noise
Generators.
- Communication & Transmitter
Filters, RF (not RFI), Quartz, SAW, Waveguide, Stripline, Microstrip,
Coaxial, Resonator and Crystal Filters.
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Precision Sub
Assembly Technology- Special Services
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24/72 hour
turn-around service-including weekends. Precision Sub Assembly
Technology can provide 24/72 hour/weekend services, under a
combination (or not) turn-key/consignment.
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Consignment - Turn-Key; Precision Sub Assembly Technology can
provide turn-key services when required or under consignment
according to customer preference.
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Prototypes
- Precision Sub Assembly Technology can provide services for
prototypes from one piece up.
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Short
Run/Medium Quantities - Precision Sub Assembly Technology can
provide production quantities from two pieces and up. We can handle
many different assemblies in limited or medium quantities (1000 pcs/month)
per part number.
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Full Automated Thru-Hole & SMT AssemblyLines -
Wafer Dicing - Lead Bonding
Hermetic Sealing - CNC Machining
Packaging -Thick Film - Photoplotting -
Thin Film Sputtering
Ceramic Hybrid Packaging - Microwave Design &
Testing
Contact:
Precision Sub Assembly
Technology
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