Bevel
cutting creates a V groove in the substrate. The major issues
to consider are bottom side chipping and smoothness of the cut
surface. The simplest bevel cut involves mounting the substrate
on dicing tape and cutting about 0.001” into the tape. This allows
the singulated parts to be cleaned and removed from the tape easily.
The difficulty is that the tape does not support the bottom side
of the substrate very well, resulting in bottom side chips of
up to several mils.
Wax mounting the substrate on glass gives better bottom side support
and consequently less chipping. The trade off is that the final
dice are more difficult to remove and clean.
A third alternative is to tape mount the substrate, but to make
the groove 50% to 75%
of the depth of the substrate. A second isolation cut with a narrow
blade to minimize chipping can then be performed.
Let one of the engineers at Precision Surface Technology evaluate
your cutting requirements. We will make recommendations and provide
samples if necessary to make sure your chips meet specifications.
Contact Us
Back To Precisioneagles Home
Page
