A
diamond saw removes brittle material by chipping it out. Chip out
will occur at some level. The important issue is to keep the chipping
within the final product specifications. Chipping can be controlled
with careful attention to the dicing process parameters: feed, speed,
coolant flow, blade exposure and composition, mechanism of mounting
the substrate, and selection of substrate materials.
Precision
Surface Technology’s engineers have had experience with many very
tight chipping specifications. Let us apply our experience to
your requirements.
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