PST can package chips individually in chip
carriers if desired.
Cleaning
and packaging dice can add considerable expense to the final product.
Since dicing is an inherently dirty operation, debris will form
during the operation. The most common and economical approach is
usually to provide a final cleaning after dicing. The dice can then
be packaged in bulk or in chip carriers for transport.
An
alternative is to coat the substrate with a protective material
before dicing. This avoids having the debris come in contact with
the substrate surface during the cutting operation. The coating
can then be removed before final packaging or simply remain in
place until the next manufacturing operation. Precision Surface
Technology has considerable experience avoiding or cleaning up
contamination. Let us discuss your concerns before they become
problems.
Contact Us
Back To Precisioneagles Home
Page
