Gallium
arsenide (GaAs) is useful to the electronics industry for its
semiconductor properties. Gallium arsenide wafers are typically
diced on tape or wax mounted on glass depending on the final requirements
for chipping and cleaning. Tape cutting simplifies handling but
can cause more edge chipping than wax mounting on glass. Wax mounting
on glass will allow more precise thru cuts and grooves, but requires
more handling during demounting and cleaning. Precision Surface
Technology’s engineers will discuss your requirements based on
our experience machining gallium arsenide to help you reach a
cost effective solution to your problem.
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