PST
has capabilities for precision dicing and machining of virtually
any hard or soft substrate. This includes ceramic, silicon, glass,
metals, as well as plastics such as Teflon. We can deliver your
diced substrates wax mounted on glass, tape mounted or cleaned and
packaged. Click on the links below for more information about specific
processes.
PROCESS
CAPABILITIES:
Bevel cutting
Burr Free Dicing
Chip Free Dicing
Cleaning & Packaging
Die singulation
Fiber optic polishing
Isolation cutting
Plated Thru Holes
Substrate edge chamfering
Substrate grooving & slotting
Thin Film Resistors
Wafer dicing
Wafer scribing
Wrap Around Metallization
Contact Us
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