Silicon
(Si) is famous for its semiconductor properties and primarily
comes in the form of wafers for electronic applications. Wafers
can be tape mounted for ease of handling the die after cutting
or can be wax mounted on glass to minimize chipping. PST can apply
a resist coating before dicing to prevent silicon dust from adhering
to critical surfaces. This can be easily removed with acetone
or photoresist developer. Our engineers have experience diamond
machining silicon as much as 0.5” (13 mm) thick. Although many
different geometries can be etched into silicon, deep trenches
with straight sidewalls usually must be done by diamond machining.
The application engineers at Precision Surface Technology are
anxious to apply their experience to your problems.
Contact Us
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